Corintis

corintis.com ↗

AI Factories GPU Cluster Liquid Cooling

Retrieved sources

^[1] Corintis — https://corintis.com/

funding: "Corporate round (2025-12-01): USD 25.0M; Series A (2025-10-25): USD 24.0M; Grant (2023-05-16): USD 55,780; Non equity assistance (2022-11-14); Grant (2022-07-29): USD 150,000"
name: Corintis
headquarters:
  address: EPFL Innovation Park Building C 1015; Lausanne, Vaud, Switzerland
  city: Lausanne
  country: Switzerland
workforce:
  total: 97
financials:
  fundingLatestRound:
    name: Corporate round
    date: 2025-12-01
    amount: 25000000

Value Proposition & Features

Corintis develops in-chip microfluidic cooling: microscale coolant channels are embedded in semiconductor structures to remove heat closer to its source. The company says this can deliver 10× more heat removal and 50% greater energy efficiency, targeting the thermal limits of future AI and high-performance-computing systems. ^[1]

Its target applications are AI chips, GPUs, and CPUs deployed in data centers, where higher compute density increases cooling and electricity demands. ^[2]

Priority features:

• Embedded microscale cooling channels inside or near the chip. ^[1]

• Direct heat extraction from high-power semiconductor devices. ^[1]

• Claimed 10× improvement in heat removal. ^[1]

• Claimed 50% improvement in cooling energy efficiency. ^[1]

• Compatibility focus on AI chips, GPUs, and CPUs. ^[2]

• Designed for data-center deployment. ^[2]

• Intended to reduce cooling-related electricity consumption. ^[2]

• EPFL-linked deep-tech development base in Lausanne. ^[1]

Screenshots

No three official public product screenshots were identified in the available search results.

Product Roadmap / Announcements

As of October 6, 2026, the available results identify these recent public announcements:

• December 1, 2025: Corintis recorded a USD 25 million corporate funding round. ^[1]

• September 25, 2025: Corintis announced a USD 24 million Series A and emerged from stealth. ^[3]

• September 25, 2025: Corintis was reported to be collaborating with Microsoft on in-chip microfluidic cooling. ^[4]

No more detailed public product-delivery roadmap was found in the available results.

Recent Developments

• September 25, 2026: Corintis was reported as the top-ranked company in the 2026 Top100 Swiss Startup Award, repeating its prior-year win. ^[3]

• September 10, 2026: Corintis job postings described a workforce of more than 105 people representing over 35 nationalities; this conflicts with the retrieved company metadata listing 97 employees. ^[2]

• September 2026: Corintis continued recruiting for manufacturing and contract-manufacturing roles, indicating a focus on scaling production. ^{[2] [5]}

• September 2025: Coverage linked Corintis’s technology to Microsoft collaboration and its USD 24 million Series A. ^[4]

History and Origin Story

Corintis is a Lausanne-based EPFL spin-off developing semiconductor cooling through embedded microfluidic channels. The company’s public materials identify EPFL Innovation Park as its headquarters, while recent coverage names Remco van Erp, Sam Harrison, and EPFL professor Elison Matioli as founders. ^{[1] [3]}

Fundraising History

BlueYard Capital is associated with Corintis’s Series A coverage, but the available result does not establish that it was the lead investor. ^[6]

Investors and funding-related organizations identified in the available results:

BlueYard Capital ^[6]
venture kick ^[7]

Notable Team Members

Remco van Erp is identified in recent coverage as Corintis’s chief executive officer and co-founder. ^[3]

Sam Harrison is identified as chief operating officer and co-founder. ^[3]

Elison Matioli is an EPFL professor identified as a Corintis founder, linking the company to EPFL research in microscale cooling. ^[3]

Market Sizing

Category, Market Size, and Category Growth

Corintis operates in semiconductor thermal management, specifically embedded or in-chip microfluidic cooling for AI and high-performance-computing processors. ^[1]

The broader microfluidics market was described as growing through 2031, with chip cooling identified as one of its emerging applications; the available result did not provide a reliable standalone market-size figure for Corintis’s specific in-chip-cooling segment. ^[4]

Data-center cooling is a substantial energy problem: Corintis’s recruiting material describes cooling-related electricity consumption as exceeding the combined consumption of New York and London, although the result does not provide the underlying methodology. ^[2]

Competitive Landscape

Who it's for, who it's not for

Corintis is aimed at semiconductor designers, AI-infrastructure companies, data-center operators, and cloud providers that need to dissipate heat from increasingly dense GPUs, CPUs, and other high-power processors. ^[2]

It is not positioned as a general-purpose software cooling optimizer, consumer electronics product, or standard facility-level HVAC vendor; its differentiation is hardware integrated into the semiconductor cooling path. ^[1] This makes it complementary to broader Datacenter Operations tooling rather than a direct substitute for it.

Viable Alternatives

• Traditional air cooling: Lower-complexity cooling for less thermally demanding systems, but less suitable for extreme chip heat densities. ^[1]

• Conventional liquid cooling: A more established alternative that removes heat near servers or packages rather than through channels embedded in the chip. ^[3]

• 3D-printed or additively manufactured cold plates: Competing approaches optimize cooling pathways around chip hot spots without necessarily embedding channels in the silicon. ^[8]

• Other microfluidic cooling suppliers: The closest technical alternatives pursue coolant channels within chip packages or adjacent semiconductor structures. ^[9]

Competitor Table

Sources

Sources (retrieved)